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TOKUYAMA EE-BOND
Light-Cured Dental Adhesive for Enamel-Etching Technique
TOKUYAMA EE-BOND

ENAMEL ETCHING TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.
 
BENEFITS

<TOKUYAMA® EE-BOND>
Outstanding adhesion performance
Dependable marginal integrity (Minimized micro-leakage)
Reduced post-operative sensitivity
Perfect cavity sealing
Less technique sensitivity
Prolonged working time
Fluoride releasing

<TOKUYAMA® ETCHING GEL HV>
Extra fine dispensing tip
High viscous gel staying on the spot
Easy to visualize, easy to rinse
   
INDICATIONS
Bonding of light- or dual-cured composite to:
1.
cut/uncut enamel
2.
cut/uncut dentin
3.
fractured porcelain/composite repair
   
PRODUCT PACKAGES AVAILABLE
TOKUYAMA® EE-BOND Intro Kit
EE-BOND Bottle / 5mL
Applicator x 25
Dispensing well
TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
EE-BONDSyringe Tip x 10
TOKUYAMA® EE-BOND Refill
EE-BOND Bottle / 5mL
TOKUYAMA® ETCHING GEL HV Kit
Syringe / 2.5mL x 2
Syringe Tip x 20
TOKUYAMAŽ ETCHING GEL HV Syringe Tip
Syringe Tip x 50
Micro Tensile Bond Strength (MPa)*
graph
 
Dependable marginal integrity
No marginal leakage observed.
(Result of dye immersion test*)

*Source: Tokuyama Dental R&D
**Not a registered trademark of Tokuyama Dental Corp.
 
 
TOKUYAMA® EE-BOND PRODUCTS

Item

TOKUYAMA EE-BOND Intro Kit
TOKUYAMA EE-BOND refill
TOKUYAMA ETCHING GEL HV Kit
TOKUYAMA ETCHING GEL HV Syringe Tip
 

SIMPLE PROCEDURE
simple procesure